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The accuracy of four widely used cure kinetics models in predicting the cure rate of a commercially available encapsulant material is assessed. Four nth order phenomenological cure kinetics models and the single step autocatalytic model are outlined. These models are fitted to Differential Scanning Calorimetry data using two differing approaches. The Borchardt-Daniels approach is outlined and utilised...
An open ended microwave oven is presented with improved uniform heating, heating rates and power conversion efficiency. This next generation oven produces more uniform EM fields in the evanescent region forming part of the heating area of the oven. These fields are vital for the rapid and uniform heating of various electromagnetically lossy materials. A fibre optic temperature sensor and an IR pyrometer...
The electrical and thermomechanical properties of isotropic conductive adhesive materials vary significantly during the material cure process as polymer crosslinking alters the molecular structure and volume of the material which, in turn, alters the percolation threshold causing step changes in the values of electrical and thermal conductivity within the material. It is therefore important to ensure...
A review of polymer cure models used in microelectronics packaging applications reveals no clear consensus of the chemical rate constants for the cure reactions, or even of an effective model. The problem lies in the contrast between the actual cure process, which involves a sequence of distinct chemical reactions, and the models, which typically assume only one, (or two with some restrictions on...
An open-ended microwave oven in the form of an open waveguide cavity partially filled with a low loss dielectric material is proposed for the curing of polymer materials during flip-chip assembly. The open-ended nature of the design allows for simultaneous precision alignment and curing of devices for fast flip-chip assembly, direct chip attach (DCA) or wafer-scale level packaging (WSLP). A well defined...
The curing of a thermosetting polymer materials utilized on micro-electronics packaging applications can be performed using microwave systems. The use of microwave energy enables the cure process to be completed more rapidly than with alternative approaches due to the ability to heat volumetrically. Furthermore, advanced dual-section microwave systems enable curing of individual components on a chip-on-board...
Encapsulant curing using a Variable Frequency Microwave (VFM) system is analysed numerically. Thermosetting polymer encapsulant materials require an input of heat energy to initiate the cure process. In this article, the heating is considered to be performed by a novel microwave system, able to perform the curing process more rapidly than conventional techniques. Thermal stresses are induced when...
Nano-imprint forming (NIF) is among the most attractive manufacturing technologies offering high yield and low-cost fabrication of three-dimensional fine structures and patterns with resolution of few nanometres. Optimising NIF process is critical for achieving high quality products and minimising the risk of commonly observed defects. Using finite element analysis, the effect of various process parameters...
A novel open waveguide cavity resonator is presented for the combined variable frequency microwave curing of bumps, underfills and encapsulants, as well as the alignment of devices for fast flip-chip assembly, direct chip attach (DCA) or wafer-scale level packaging (WSLP). This technology achieves radio frequency (RF) curing of adhesives used in microelectronics, optoelectronics and medical devices...
The use of variable frequency microwave technology in curing of polymer materials used in microelectronics applications is discussed. A revolutionary open-ended microwave curing system is outlined and assessed using experimental and numerical approaches. Experimental and numerical results are presented, demonstrating the feasibility of the system.
With the growth in computing power, and advances in numerical methods for the solution of partial differential equations, modeling technologies based around computational fluid dynamics, finite element analysis and optimisation are now being widely used by researchers and industry. Polymer and adhesive materials are now being widely used in electronic and photonic devices. This paper will illustrate...
This paper presents modeling results about the performance of flexible substrates when subjected to higher lead-free reflow temperatures. Both adhesiveless and adhesive types of polyimide substrates were studied. Finite element (FE) models of flex substrates were built, two copper tracks located in the centre of the substrate was considered. The thermal induced shear stress in the flex substrate during...
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