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Shrinking features and growing device complexity with today's advanced devices has led to increased challenges of gaining a full understanding of device thermal behavior. At the same time, with higher power densities having a full understanding of the device static and dynamic thermal behavior is essential for ensuring optimal tradeoffs between performance and device reliability. Thermal imaging based...
Transient thermoreflectance 2D thermal imaging is rapidly proving to be an effective technique for meeting the thermal analysis challenges inherent with today's advanced high speed integrated circuits. Using near infrared light illumination is particularly suitable for the thermal imaging of flip chip mounted devices and silicon substrate chips. High speed transient imaging reveals the timing of heating...
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