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Optical interconnection between LSIC (Large Scale integrated circuit) is an increasing demand as data communication is growing very fast, whereas electronic interconnection could hardly satisfy the fast-growing request of data rate. A realization of on-board optical connection is described in this paper, of which multimode fibers were buried into the RF4 board by cutting grooves on the surface of...
Deep etching of Ge-doped SiO 2 using an epoxy based negative resist and a Chromium film as a mask in CHF 3 /O 2 plasma has been investigated. Parameters varied in design that include radio-frequency (RF) power, gas ratio, work pressure and gas total flux, and the major etch responses including etch rate and selectivity are modeled. In the high etch rate and high selectivity...
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