The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
Semiconductor component manufacturers supply to different product manufacturers in a wide range of market segments, for different end use applications. The goal of electronic component qualification is to demonstrate component reliability under operating conditions in the end product configuration. While a manufacturer may have successfully qualified an individual component, operating stresses due...
Recently, the SiC chip for power devices had been developed to downsize the cooling system, because the operative temperature of SiC chip can be increase to over 300°C. However it is necessary to realize low temperature mounting and high reliability in high temperature. The author's group has proposed a new method using Ag-Nano material to mount the SiC chip on a Al board. The Ag-Nano can be mounted...
This paper focuses on the study of the drop-impact reliability of solder joints of integrated circuit components on printed circuit boards. The impact strength and impact toughness of solder alloys are investigated by performing the ball impact test (an experimental approach). For comparison with experimental results, the fracture of a single solder joint specimen is numerically simulated using the...
Semiconductors are solids whose electrical conductivity is intermediate between that of a conductor and an insulator. Semiconductor devices are active devices that consume, accumulate, and discharge the supplied electric power. They are used as electronic or power devices. The former are employed in the control systems of electrical products such as mobile phones and computers, which are controlled...
This paper presents pressure induced tin whisker formation by means of nanoindentation creep. Bright tin-copper finish was plated on a rectangular coupon made of phosphor bronze with nickel underlayer. Applied load was from 1 mN to 80 mN. Small tin whiskers were formed along a contact edge after the dwell time of 3000 seconds with the application of more than 4 mN. Since tin whisker growth produces...
Interconnect technology is the key to the reliability of electronic devices. Electronic components are soldered to a printed circuit board (PCB). Major failure mode is thermal fatigue of solder joints since there is a big difference in the coefficient of thermal expansion (CTE) between soldered components. Underfill resin is used to improve the interconnect reliability. Resin can relief stresses in...
Interconnect technology is the key to the reliability of electronic devices. Electronic components are soldered to a printed circuit board (PCB). Major failure mode is thermal fatigue of solder joints since there is a big difference in the coefficient of thermal expansion (CTE) between soldered components. Underfill resin is used to improve the interconnect reliability. Resin can relief stresses in...
This paper presents the effect of creep properties on pressure-induced tin whisker formation. Creep properties of bright SnPb and SnCu finishes were evaluated by using a nanoindentation test. At the early stage of indentation, power law creep has a small scatter in both plating finishes. On the other hands, diffusion creep in SnCu show big scatter than SnPb. This behavior can explain the whisker formation...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.