The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
In this study, the aim is to establish the efficient method of life evaluation with checking it's consistent with real test. Firstly, as to the effect of hardening rule, differences between analysis result of isotropie and that of kinematic are small and analysis time of kinematic is longer than that of isotropie. Isotropie hardening is more effective, and its utility is higher than that of kinematic...
This paper presents the result of verifying Miner's law of the solder joint part by mechanical fatigue tests and FEM analysis. The author's group have studied the Manson-Coffin's law for lead free solder joint by using the isothermal fatigue test and FEM analytical approaches to establish the practicable evaluation of thermal fatigue life of solder joints, for example, for the Sn-Cu solder, because...
For power module, the reliability evaluation of thermal fatigue life by power cycling has been prioritized as an important concern. Since in power cycling produces there exists non-uniform temperature distribution in the power module, coupled thermal-structure analysis is required to evaluate thermal fatigue mechanism. The thermal expansion difference between a Si chip and a substrate causes thermal...
This paper presents the influence of the micro structure on the crack propagation in lead free solder joint. The author's group have studied the Manson-Coffin's law for lead free solder joint by using the isothermal fatigue test and FEM analytical approaches to establish the practicable evaluation of thermal fatigue life of solder joints, for example, for the Sn-Cu solder, because this solder is attracted...
Semiconductor component manufacturers supply to different product manufacturers in a wide range of market segments, for different end use applications. The goal of electronic component qualification is to demonstrate component reliability under operating conditions in the end product configuration. While a manufacturer may have successfully qualified an individual component, operating stresses due...
This paper presents the high reliability design method for lead-free solder joints on chip components, and that is able to evaluate effect of soldering process for solder joint shape. Coupled analysis of structure analysis and flow analysis was proposed for replication of solder wetting and behavior of electric components at the same time. The analysis methods enable to evaluate complex mechanism...
This paper presents a fundamental method to evaluate power cycle fatigue life of power device. Coupled electrical-thermal analysis is performed to obtain the distribution of temperature due to electric current. Then, thermal-mechanical analysis is carried out to calculate inelastic strain range generated in a solder joint. In addition, the fatigue evaluation for aluminum wire bonding was carried out...
This paper presents a fundamental method to evaluate thermal fatigue life of power module. Coupled electrical-thermal analysis is performed to obtain the distribution of temperature due to electric current. Then, thermo-mechanical analysis is carried out to calculate inelastic, aluminum wire bonding was done. Crack path simulation technique was used to evaluate total fatigue life of solder joint and...
This paper presents a method mining the worst thermal fatigue life of solder joints on chip components used in vehicle electronics. Thermal fatigue life of crack initiation and propagation were calculated by using the finite element method. Statistical analysis of thermal fatigue life in the solder layer below the chip component was carried out. A sample of dispersed fatigue lives was generated by...
This paper presents mining the worst thermal fatigue life of solder joints on chip components used in vehicle electronics. The authors proposed an isothermal fatigue test method using real size solder joints to get the fatigue properties. The Manson-Coffin's law given by this method could improve the agreement between the simulation model and experimental results. Based upon the Manson-Coffin's law...
This paper presents a fundamental method to evaluate thermal fatigue life of power module. Coupled electrical-thermal analysis was performed to obtain the distribution of temperature due to electric current. Then, thermo-mechanical analysis was carried out to calculate inelastic strain range generated in a solder joint. Crack path simulation technique was used to evaluate total fatigue life and rise...
This paper presents mining the worst case of thermal fatigue life of solder joints on chip components used in vehicle electronics. Typical 36 cases with various solder shapes were examined. Thermal fatigue life including not only the crack initiation but also crack propagation was evaluated by using the finite element method. Based upon the case study's results, it was found that when a crack propagates...
The fatigue life considering dispersion of solder joints on chip resistor was investigated by experimental approach and analytical approach. The significant difference of crack propagation ratio was found each specimen by experimental approach. However, it is difficult to clarify the reasons of the difference for the fatigue life of solder joint quantitatively. So, the analytical approach that estimates...
As the integration and the miniaturization of electronics devices, design space become narrower and interactions between design factors affect their reliability. This paper presents a methodology of quantifying the interaction of each design factor in electronics devices. Thermal fatigue reliability of BGA assembly was assessed with the consideration of the interaction between design factors. Sensitivity...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.