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This paper presents a fundamental method to evaluate power cycle fatigue life of power device. Coupled electrical-thermal analysis is performed to obtain the distribution of temperature due to electric current. Then, thermal-mechanical analysis is carried out to calculate inelastic strain range generated in a solder joint. In addition, the fatigue evaluation for aluminum wire bonding was carried out...
This paper presents a fundamental method to evaluate thermal fatigue life of power module. Coupled electrical-thermal analysis is performed to obtain the distribution of temperature due to electric current. Then, thermo-mechanical analysis is carried out to calculate inelastic, aluminum wire bonding was done. Crack path simulation technique was used to evaluate total fatigue life of solder joint and...
This paper presents a method mining the worst thermal fatigue life of solder joints on chip components used in vehicle electronics. Thermal fatigue life of crack initiation and propagation were calculated by using the finite element method. Statistical analysis of thermal fatigue life in the solder layer below the chip component was carried out. A sample of dispersed fatigue lives was generated by...
This paper presents a fundamental method to evaluate thermal fatigue life of power module. Coupled electrical-thermal analysis was performed to obtain the distribution of temperature due to electric current. Then, thermo-mechanical analysis was carried out to calculate inelastic strain range generated in a solder joint. Crack path simulation technique was used to evaluate total fatigue life and rise...
In electronic equipment, the estimated lifetime of a solder joint is being intensively investigated. For the assessment of thermal fatigue reliability, the mechanical properties of solder joints with regard to inelastic characteristics at a range of temperatures must be known. However, measuring solder's material properties is costly and time-consuming. Thus, a quick and simple technique should be...
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