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In this work we present a procedure for the construction of 3D networked epoxy moulding compounds and an estimation of basic thermodynamic properties by molecular dynamics simulations. Our investigations present part of general trend to extend failure analysis, reliability assessment and the development of packaging materials from the conventional discrete usage of simulation techniques to a more...
This paper addresses the potential of molecular dynamics simulation for structure-property correlations in epoxy-resins. This is an important topic within a multi-scale framework to lifetime prediction in electronic packaging. For that purpose, epoxy-resins with small systematic variations in chemical structure have been synthesised and then characterised by various thermo-mechanical testing methods...
In this paper the potential of molecular dynamics simulation for structure-property correlations in epoxy-resins is discussed. This is a topic relevant for a multi-scale framework to lifetime prediction in microelectronics packaging. To achieve that objective, epoxy-resins are synthesised by systematically varying their chemical structure and then characterised by various thermo-mechanical testing...
We made a structure property correlation (SPC) by altering systematically the chemistry of a cross-linked epoxy resin and examining the material behaviour and failure mechanisms under the external influence of moisture, temperature and stress. The epoxy resin (aromatic epoxy: 1,3-Bis-(2,3-epoxypropyl)-benzene and amine hardener: 1,2-Diaminoethan ) was examined under different loading conditions (65degC/75rh,...
The properties of epoxy based materials alter, when exposed to humid environment and temperature. To better understand the failure mechanisms on microelectronic packaging we examine these epoxies (aromatic epoxy: l,3-Bis-(2,3-epoxypropyl)-benzene and amine hardener: 1,2-Diaminoethan ) under different initial conditions of temperature (300-400 K) & humidity (85,100 RH) and change systematically...
The authors first investigate a polymeric composite material ( epoxy resin with silicone nanoparticles) and determine its mechanical properties (coefficient of thermal expansion-CTE and Young's Modulus-E) by a combined experimental and simulative (homogenisation) approach. The size distribution and the volume fraction percentage of the nanoparticles were determined as well as the variation of the...
The present work deals with the self-diffusion coefficient of water molecules in amorphous polymeric materials (aromatic epoxy: 1,3-Bis-(2,3-epoxypropyl)-benzene and amine hardener: 1,2-Diaminoethan). Both experiments and molecular dynamics (MD) simulations examine the temperature range of 300-400K, where diffusion coefficients are calculated under NVT-thermodynamic boundary conditions by using a...
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