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Ultra-fine pitch (6μm) interconnects are essential for high-end application-products that demands high speed and high bandwidth inter-chip communication. Achieving Cu-Cu bonding with such a fine pitch is challenging since bond time is too long and bond interface gets easily oxidized. Throughput issue associated with long-bonding time is solved by using 2-step bonding procedure where first step is...
Three dimensional (3D) IC integration technologies have become essential as the market demands for product with low power consumption, multi functions, smaller size and faster response have been increasing. 3D stacking with conventional high melting temperature solders such as SnAg and Sn may induce high thermal stress to the package. In this paper, chip to chip 3D stacking using no flow underfill...
Micro mirror packaging development for pico-projector application requires integration of magnets, silicon spacer and glass cap. A multilayer stack package has been designed for large deflection micro mirror. The magnets are used for electromagnetic actuation and are attached on either sides of the silicon beam by a pick and place machine. Different epoxy materials are evaluated to optimize the magnet...
A disposable self-contained microfluidic package has been developed and tested for on-chip DNA extraction from human blood for practical lab-on-a-chip platform. The microfluidic package has been customized to allow easy interface between the microscale sample injection to the Si-based microscale sample preparation chip. For precise sample dispensing and to minimize dead volume and/or sample lost conical-shaped...
A disposable microfluidic cartridge for DNA/RNA extraction has been developed. Different reagents are used to bind and unbind DNA on the chip used in the cartridge. The extraction of DNA/RNA is based on a particular protocol, which involves the dispensing of different reagents at various flow rates. Dispensing of reagents is controlled by a needle valve which is integrated in the reservoir. With the...
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