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This paper presents a novel approach to in-line chemical gas flow monitoring, employing a high-Q RF resonator coated with a polymeric sensing material. The polymeric sensing materials employed are OV-275 and P25DMA doped with 20% NiO. These materials are known to be responsive against various VCOs, and are individually coated on the post of a combline cavity resonator to help functionalize the sensor...
This paper presents a novel application of RF-filter parameter extraction techniques with coupling matrix model to obtain decoupled capacitive sensor readings from the S11 of a single-port, multi-resonator passive RF resonant sensor array. As an example application, two dual-resonator sensor arrays loaded with four selected functional polymers are implemented to allow ethanol and acetone identification...
This study implements structural equation model (SEM) to build a framework containing critical success and failure factors of construction partnerships in Taiwan. It is found that the four critical success factors (cultural collaboration, long-term quality, consistency, and resources) are closely linked to one another, and so as are the four critical failure factors (lack of flexibility, lack of trust,...
In this study, flip chip (FC) daisy chain test dies with Sn- Ag-Cu solder bumps on Al/Ni(V)/Cu UBM were subjected to a high temperature storage (HTS) test at 175degC for up to 2000 hours. Solder bump shear tests were then performed and the electrical resistance of a daisy-chain pair of solder bumps was measured to investigate the effect of high temperature storage on the reliability of Sn-Ag-Cu solder...
Wafer level packaging (WLP) technology stands at the industry structure interface between the wafer foundry and the assembly and packaging houses. At the same time, it must take full advantage of the symbiotic relationship between different layers of the supply chain for the knowledge base of materials, processes, and equipment from both the semiconductor and assembly industries to develop the inventions...
We reported on characterization of 2-terminal and 3-terminal InGaP/GaAs heterojunction phototransistors (HPTs). For a current-bias 3T-HPT, an independent current flowing into or out of base electrode is employed. Addition of biased current pushes HBT's operating point to a higher current level where the current gain is larger. It is found that the optical gain increases from 28.4 for a 2T-HPT to 34...
Differing from those conventional HPTs with and without the base electrode reported in the past, we introduce a three-terminal heterojunction phototransistor with double emitters (DE-HPT). The double emitters in the HPT are designed to exhibit a series of different area ratios (A1:A2), but the same total area. Furthermore, the two emitters together with the common collector form a new three-terminal...
Summary form only given. Characteristics of failure mechanisms in laser welding technique for semiconductor laser packaging were investigated by metallographic microscopes. The results showed that both hole and crack failures in laser packaging can be eliminated. Based on the detailed understanding of failure mechanisms in laser welding process, a reduction of post-weld-shift (PWS) technique for fabricating...
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