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Chip scale package (CSP) as an advanced technology has been applied to LED lighting devices, besides electromigration (EM) in CSP under high current density has become a critical reliability issue for the future high density microelectronic packaging. In this paper, the thermal-electric-mechanical coupled analysis is performed by the flip-chip CSP LED multi-physical finite element model. Based on...
White light-emitting diodes (LED) are widely applied in many fields for its special advantages compared with other light sources. Chip-scale-package (CSP) is one of the hotspots in the research of microelectronics, and also the main stream and development direction to the future package technology. Within a CSP, the solder layer between LED chip and substrate is usually achieved via reflow processes...
The development of automotive lighting systems with high illumination quality and high reliability is essential for driving safe and comfort. LEDs have many superiorities over the traditional light sources, such as high reliability, good color quality, long lifetime, energy and space saving, environment friendly and so on, when they are operated under an effective health management (such as thermal,...
In this paper, an integrated LED lamp with an electrolytic capacitor-free driver is considered to study the coupling effects of both LED and driver’s degradations on lamp’s lifetime. An electrolytic capacitor-less buck-boost driver is used. The physics of failure (PoF) based electronic thermal simulation is carried out to simulate the lamp’s lifetime in three different scenarios: Scenario 1 considers...
Recently, with the increasing requirements on guaranteeing the color uniformity and improving the luminous efficacy and manufacturing efficiency, a wafer level chip scale packaging (WLCSP) technology has been developed by thermally impressing a thin multiple phosphor film on a LED wafer, then being segmented into individual LED chips. In this paper, a high power white LED Chip-on-Board (COB) module...
The influence of viscoelastic behavior of polybutylene terephthalate (PBT) on reliability of the thermal contact of a spotlight module is evaluated. The contact between a module and the heat sink is evaluated using non-linear finite element model. The viscoelastic behavior of PBT was obtained under multiple frequencies from single cantilever DMA experiments. The relevant viscoelastic parameters (i...
The influence of viscoelastic behavior of polybutylene terephthalate (PBT) on reliability of the thermal contact of a spotlight module is evaluated. The contact between a module and the heat sink is evaluated using non-linear finite element model. The viscoelastic behavior of PBT was obtained under multiple frequencies from single cantilever DMA experiments. The relevant viscoelastic parameters (i...
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