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A small form system in package (SIP) is required to interface with multiple integrate circuit (ICs) of different functionality, passive components, and/or MEMS assembled into a single package that performs as a system or sub-system, this raise a great challenge to related either flip chip or wire bond interconnect technology in electronic packaging for high density, small feature size, and high performance...
The personal electronics market is experiencing rapid growth where smaller electronics carrying more functionality is required. Increasingly, small electronic devices are expected to be incorporated into personal accessories and clothing to make them wearable. This raises great challenges to the substrate technology and related assembly technologies in electronic packaging for high density, small...
The personal electronics market is experiencing rapid growth where smaller electronics carrying more functionality is required. Increasingly, small electronic devices are expected to be incorporated into personal accessories and clothing to make them wearable. This raises great challenges to the substrate technology and related assembly technologies in electronic packaging for high density, small...
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