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For wireless high-data-rate applications, channel sounding, and radar sensors, the unlicensed frequency band around 60 GHz is of relevant commercial interest. Currently, there is enormous progress in the field of integrating 60 GHz technology in compact systems using multilayer technology and reducing costs for mass production. For full channel characterization, but also for consumer applications,...
This paper presents methods and results of accurate dielectric property measurements of the widely used DuPont DP-943 and DP-951 low temperature co-fired ceramic material systems. The relative dielectric permittivity and loss tangent for both substrate materials is evaluated over a frequency range from 5 to 65 GHz. From 15 GHz up to 65 GHz the dielectric permittivity remains nearly constant at ≈7...
A technique for the fast and efficient modeling of complex microwave modules is investigated. In order to reduce simulation and optimisation time of spatially extended transmission line structures, a library of basic microwave components together with an approach for the decomposition and cascaded simulation of extended microwave circuits is proposed. To verify the design method, simple test structures...
Some of the trends in the communication industry consist in increasing the variety and/or number of integrated functions in portable devices as well as reducing their size. Because of these trends, forthcoming portable wireless devices have to comply with more demanding hardware requirements, especially regarding higher wiring densities and miniaturisation level. A suitable combination of system architecture,...
Due to their excellent microwave behaviour (low or moderate dielectric loss, highly conductive inks) and their hermeticity, LTCC materials are being widely used for MMIC packaging. The latter is often required to protect bare dies against the impact of harsh working conditions on the field. Several applications, such as front end modules for mobile communication or transmit modules for point-to-point...
Packaging of microwave components and systems for space use is very challenging since high frequency, thermal and hermeticity aspects need to be considered. Furthermore, these packages have to be reliable under various environmental work conditions. Ball Grid Array (BGA) or Land Grid Array (LGA) packages are typically used for microwave applications. BGAs are better investigated in terms of reliability...
In this paper a novel Ka-band cavity-backed elliptically-shaped dipole antenna to be manufactured using multi-layer low temperature co-fired ceramic (LTCC) technology is presented. Ultra-wideband non-absorbing shielding has been developed to reduce backward antenna radiation. Differential feeding is used for easy matching to RF circuits with differential input/output. The antenna simulated impedance...
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