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In an industry which demands for continuous innovation and perfection, we are constantly deriving new processes and solutions to break the technological limits which will set us apart. We are striving to achieve denser integrated circuits for better performance as Moore's law perceives and also redefining the word, “Thin”. Driven by cost and in order to achieve thinner IC packages, we have created...
Objectives MRI has allowed the study of mineral deposition in the brain throughout life and in disease. However, studies differ in their reporting of minerals on MRI for reasons that are unclear. Methods We conducted a systematic review from 1985 to July 2011 to determine the appearance of iron, calcium, copper and manganese on MRI and CT and their reliability. We assessed which imaging investigations...
This paper is to evaluate the thermal performances of a Direct Plated Copper (DPC) substrates attached on a high performance MCPCB thermal board for high brightness LED (HBLED) applications. The advantages of DPC substrate compared to traditional Direct Bond Copper (DBC) substrate include: more robust bonding between the substrate and copper metallization, ability to offer substrates with a wide range...
Copper wire ball bonding has gained popularity in the last few years due to its economic advantage and superior electrical performance. However, because of copper's reactive nature to oxygen, free air ball formation for copper bonding is more crucial than in the gold wire process. To create a free air ball (FAB), the wire bonder uses an electronic flame-off (EFO) unit. During operation, a high voltage...
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