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The dynamic responses of printed circuit boards (PCBs) mounted with thin-profile fine-pitch BGA (TFBGA) packages under board level drop tests were investigated. Data captured during the tests include accelerations, in-plane strains and in-situ change in solder joint resistance. PCBs were mounted on the drop table using either 4-screw or 6-screw supports. A high-speed charge-coupled device (CCD) camera...
Portable electronic products are found to be most susceptible to drop impact during transportation or customer usage. This may induce dynamic bending in the printed circuit board (PCB) and result in component and product failure. The failure rates at these different locations of PCB are monitored so as to understand the relationship between PCB dynamic strains and solder joint failure under drop test...
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