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Thermoelectric conversion (TEC) technologies, which convert heat into electricity, have received a great attention, because they are expected to be a powerful approach to utilize wasted thermal energy. Here we present novel thermoelectric converters based on the spin Seebeck effect (SSE), and show their scaling law which is largely different from that of conventional TEC devices. We experimentally...
In order to achieve the excellent electrical performance, as well as low warpage and high heat removal, electrical design techniques for an ultrathin large-scale integration (LSI) package embedding a high-pin-count LSI chip in the thin package substrate have been developed. The embedded chip package we designed is 27 mm 27 mm in size and 0.71 mm in thickness with a heat spreader. The package...
Noise coupling in mixed-signal system-in-packages (SiPs) has been investigated experimentally. Four BGA types of mixed-signal SiPs consisting of a sound source LSI chip (victim) and a speaker amplifier LSI chip (aggressor) have been designed and fabricated for investigating noise coupling from a Class-D amplifier and a DC-DC converter of the speaker LSI to a PLL of the sound source LSI. The two types...
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