The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
In this paper, pure silver (Ag) joints between silicon (Si) chips and copper (Cu) substrates are produced successfully at a temperature much lower than its melting point. Silver is ductile and has low-yield strength. It can deform to release the shear stress caused by the large mismatch in coefficient of thermal expansion between Si and Cu. Silver also has the highest electrical conductivity and thermal...
Direct bonding between large silicon (Si) chips and copper (Cu) substrates using pure silver (Ag) as bonding material has been successfully developed. The Si-Ag-Cu direct bonding process was performed in two assembly structures, die attachment and flip-chip interconnect, at low process temperature of 250degC. It is a typical reflow temperature of lead-free (Pb-free) solders. In die attachment structure,...
Fluxless bonding between large silicon (Si) chips and copper (Cu) substrates using electroplated indium (In) and silver (Ag) as solders has been successfully developed. The nucleation mechanism in In-Ag system is first studied. It is interesting to discover that In reacts with underlying Ag and forms Agln2 as soon as it is electroplated at room temperature. To reduce stress caused by coefficient of...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.