The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
The wafer level non conductive film (WL-NCF) has been developed, which has dynamic temperature dependence of viscosity. The b-stage WL-NCF was laminated onto the wafer without void, which has 870 Au bumps of 15 mum height and 25 mum pitch. The wafer with the WL-NCF on the surface was cut into chips by standard dicing process. The chip which has the NCF on the surface was bonded onto the ITO wired...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.