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Solder paste printing is one of the most important steps in the surface mount technology, which has high influence on the resulting quality of solder joints. To achieve a good joint quality, the solder paste should have specific properties like adhesion, viscosity, size of the solder alloy particles, amount of flux etc. This paper is focused on the measurement of the solder paste viscosity during...
Surface mount technology is commonly used technology in electronics assembly. It is a method where the components are mounted directly onto the surface of printed circuit board. This article deals with risk analysis of surface mount technology in electronics assembly. Risk analysis applies many methods of analysis with the focus on potential hazards. Its aim is to improve understanding of process...
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