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Mechanical stress act on solder joints during transport, function and storage of the electronic equipment. Therefore, the knowledge of solder joints resistance against it is very useful. This article deals with comparison of mechanical resistance of SnCu0,7 and Sn42Bi58 solder alloys. The experiments were based on two PCBs (smaller and larger one, with soldering pads designed according to commonly...
Mechanical properties of solder joints have influence on reliability of electronic products. Therefore the knowledge of the mechanical behavior of solder joints is very important. This article deals with comparison of mechanical properties of solder joints prepared with conventional soldering methods and ultrasonic soldering methods. Material for samples preparation was based on two PCB (material...
Solder paste printing is one of the most important steps in the surface mount technology, which has high influence on the resulting quality of solder joints. To achieve a good joint quality, the solder paste should have specific properties like adhesion, viscosity, size of the solder alloy particles, amount of flux etc. This paper is focused on the measurement of the solder paste viscosity during...
This contribution introduces Failure Mode and Effect Analysis (FMEA) method applied for screen printing process. A model based paradigm is used for executing FMEA method. The Authors employ this approach for increasing its efficiency and productivity. This work builds on the achievements resulting from the previous works concerning applying the Model Based FMEA method for technological processes and...
The work deals with thick film resistors and their properties. The structures of resistive and conductive thick film layers were prepared by screen-printing by polymer thick film pastes. Samples were exposed to accelerated ageing in environment with enhanced temperature and humidity. Tested sample consist of thick film resistors with different width and length. The non-linearity of current-voltage...
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