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Increasing complexity and manufacturing costs, along with the fundamental limits of planar CMOS devices, threaten to slow down the historical pace of progress in the semiconductor industry. We report herein an efficient, low-cost, "greener" way to fabricate dual-damascene copper (Cu) on-chip interconnect or Back-End-Of-the-Line (BEOL) structures using a novel multifunctional on-chip insulator,...
Thermal behaviour of blends of a liquid crystalline copoly(ester amide) (Vectra B950) with two isotropic polymers has been studied by differential scanning calorimetry. One of the isotropic polymers is an amorphous polymer – polycarbonate, the other is a semi-crystalline polymer – poly(ethylene terephthalate). It was found that the glass transition temperature of polycarbonate decreases with increasing...
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