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There is a rapid transition in the semiconductor packaging industry of devices moving toward 40/45-nm extreme low k (ELK) from the development phase into mainstream semiconductor assembly manufacturing. The drive to achieve adoption without major changes to process and equipment infrastructure while meeting the superior yield necessary is high. The main goal of this paper is to share learning's and...
Copper pillar bumping is a promising solution to cope with the challenges which flip chip packages face when bump pitch size keep shrinking. A large FCBGA (flip chip ball grid array) package for 45 nm Cu/Low-K device with Cu pillar bumps is chosen to investigate the package reliability. Finite element models have been built with multi-level sub-modeling technique to consider the detailed Cu/Low-K...
The advances of semiconductor technology are highly dependent on the advances of polymeric materials. These include the use of polymers as adhesives (both conductive and nonconductive), interlayer dielectrics (low-k, low loss dielectrics), encapsulants (discrete and wafer level packaging), embedded passives (high-k and high-Q materials), superhydrophobic selfcleaning lotus effect surfaces, etc. In...
The objective of the present study is to develop a robust high-throughput assembly process of light emitting diode arrays for wide area general lighting. Topics to be covered in this paper include the conceptual design, the flexible printed circuit substrate, flip chip assembly, yellow phosphor coating, and encapsulation. All these are integrated into one reel-to-reel assembly process. A prototype...
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