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The objective of the present study is to develop a robust high-throughput assembly process of light emitting diode arrays for wide area general lighting. Topics to be covered in this paper include the conceptual design, the flexible printed circuit substrate, flip chip assembly, yellow phosphor coating, and encapsulation. All these are integrated into one reel-to-reel assembly process. A prototype...
The advances of semiconductor technology are highly dependent on the advances of polymeric materials. These include the use of polymers as adhesives (both conductive and nonconductive), interlayer dielectrics (low-k, low loss dielectrics), encapsulants (discrete and wafer level packaging), embedded passives (high-k and high-Q materials), superhydrophobic selfcleaning lotus effect surfaces, etc. In...
The objective of the present study is to develop a robust high-throughput assembly process of light emitting diode arrays for wide area general lighting. Topics to be covered in this paper include the conceptual design, the flexible printed circuit substrate, flip chip assembly, yellow phosphor coating, and encapsulation. All these are integrated into one reel-to-reel assembly process. A prototype...
Carrier Ethernet is one of the fastest growing areas in the data communication field in recent years. In particular, the combination of MPLS core transport technologies in conjunction with IEEE 802.1ah in aggregation is one of the most interesting recent developments in the Carrier Ethernet evolution. This article provides a brief overview of the Ethernet technologies and requirements from the perspective...
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