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Six critical issues relating to interfacial reactions arising from space confinement in 3-D integrated-circuit (3-D IC) packaging are presented in this paper. The first issue arises from the concern that intermetallics (IMCs) may occupy a large portion of the solder joint volume. It will be demonstrated that this concern is real even for Ni under bump metallurgy (UBM) or surface finish, which reacts...
Spatially localized enhanced evanescent coupling between a tapered optical fiber and a high-Q dielectric microresonator results from the resonant excitation of surface plasmons of Au nanowire fragments deposited non-uniformly on the surface of the microresonator.
Thin film edge emitting lasers with top/bottom stripes are broad area metal/metal bonded to a Si substrate. The bonding and top/bottom stripes are steps forward toward better heat dissipation, current confinement, and mechanical bonding strength.
Integration of photonic active and passive components - and ultimately, full systems - directly onto Si and Si CMOS are a critical step toward chip scale photonic system integration. Thin film compound semiconductor lasers heterogeneously integrated onto silicon open up a wide range of applications, including portable sensing systems, optical interconnects, and chip scale ultrafast optical signal...
ZnO nanostructures were grown from a solution of zinc nitrate hexahydrate and hexamethylenetetramine onto different substrates that were pretreated with an RF sputter coated ZnO seed layer. The choice of substrate was observed to have a direct effect on the morphology, orientation and surface coverage of the nanostructured arrays. Substrates that were covered in a 1.2 mum sputter coated ZnO seed layer,...
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