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Six critical issues relating to interfacial reactions arising from space confinement in 3-D integrated-circuit (3-D IC) packaging are presented in this paper. The first issue arises from the concern that intermetallics (IMCs) may occupy a large portion of the solder joint volume. It will be demonstrated that this concern is real even for Ni under bump metallurgy (UBM) or surface finish, which reacts...
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