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Warpage is a critical issue for an electronic package molding process. Much work is done in the past to predict the warpage of a package after the cooling down from the molding process. However, there are many material models for the molding compound to predict warpage: Elastic and viscoelastic models are used, and there are even groups which use cure-dependent viscoelastic models. In this paper,...
Warpage is a critical issue for a QFN panel molding process. Much work is done in the past to predict the warpage of a package during cooling down from molding temperature. However, until now, warpage could not always be predicted well, even if the viscoelastic behavior of the molding compound is taken into account. It was for example observed that the cooling velocity affected the warpage after cooling...
Reliability calculations of the microelectronic packages require cure dependent viscoelastic constitutive relationship for the packaging polymers in order to predict residual stress and strain fields in the final product. The residual stresses can result in the product failure due to warpage, interfacial delamination, thermal fatigue etc. The previous work in the same group (Ernst et al. 2006, 2003)...
This work is focused on numerical investigation of the corner delamination behavior at the chip top surface of plastic encapsulated semiconductor packages which is induced under temperature loading. Two points of interest are pursued in this study: 1) impact of mold compound (MC) material properties and 2) influence of package geometry on the delamination behavior. For the first part we identify influence...
During the packaging of electronic components stresses are generated due to curing effects and the difference in thermal shrinkage between molding compound and die. For a reliable simulation of the stresses generated in a package during cure and subsequent cooling it is essential to have accurate data for the thermal and mechanical properties of the molding compound, die, solder and substrate materials...
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