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This study combines direct measurements of strain, electrical mobility measurements, and a rigorous modeling approach to provide insights about strain-induced mobility enhancement in FinFETs and guidelines for device optimization. Good agreement between simulated and measured mobility is obtained using strain components measured directly at device level by a novel holographic technique. A large vertical...
Microdrawing is an important process of fabricating the microparts, especially the metal microparts. Under the micro tension test, it was found that the stress-strain curve increased steeply in the elastic deformation stage but gradually in the plastic deformation stage, with the decrease of the grain size. According to the stress-strain curve, the material model was established. Then the influence...
The stress effect at the channel region of pFETs with compressive stress liner (c-SL) and eSiGe using replacement gate technology is firstly investigated in detail based on the combination of UV-Raman spectroscopy and 3D stress simulation. The gate length effect for the channel stress is confirmed by measurement and simulation. Moreover, the Ion dependence on the channel width is also investigated...
Damascene gate process enhances the drivability in shorter gate length region, as compared to conventional gate 1st process for pFETs with compressive stress SiN liner and embedded SiGe. The origin of the gate length effect is investigated for the first time by using the UV-Raman spectroscopy. Moreover, the relationship between channel strain and gate width for damascene gate pFETs is analyzed and...
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