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We will discuss in detail the progress that has been made at RTI in developing chip-in-flex technologies, including specific applications such as sensors and implantable prostheses. We will discuss the advantages of this approach over traditional packaging techniques. We will also give an overview of related flexible electronics activities at RTI, including power, lighting, and sensor array technologies.
Flexible, large area electronics - macroelectronics - using amorphous silicon, low-temperature polysilicon, or various organic and inorganic nanocrystalline semiconductor materials is beginning to show great promise. While much of the activity in macroelectronics has been display-centric, a number of applications where macroelectronics is needed to enable solutions that are otherwise not feasible...
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