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In order to match high power density and large counts of I/Os with the need for smaller-sized automotive electronic devices and low cost, new solutions have to be developed without any concessions to reliability. The authors describe the so-called i2Board concept, developed by Schweizer Electronic AG and used in the VISA project, funded by the German Government. VISA is an abbreviation and means "fully...
Sensor packages have often to be adapted to current customer requirements. Dimensions, interior structures, or materials may change. In general, this influences strongly the thermally induced warpage during the wafer level manufacturing process and of the separated single packages which has to be controlled with respect to reliability issues. Therefore, the package manufacturer needs for a proved...
More and more dense packaging is one of the most important challenges in advanced electronics and micro technology. One way to achieve this is to bury active as well as passive components into the printed circuit boards. In addition, very short interconnects can be realised which is advantageous especially for RF applications. Besides the pure functionality, the designers of new products have to meet...
Within the framework of the project VERSA, a new approach to beam forming networks is investigated. The aim is to combine structural and electrical functions in one multilayer to gain electrical performance and to save weight. For this purpose a library of standard components for the RF-designer is developed, as well as the fabrication technology to produce these modules reliably and with high yield.
More and more dense packaging is one of the most important challenges in advanced electronics and micro technology, driven by requirements like low cost and high reliability. One way to meet these demands is to follow the so-called ldquochip in duromerrdquo approach, which allows an extremely dense integration and very short interconnects. Already in the very first design phase of advanced products,...
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