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This paper presents a configurable SRAM with 0.149 ??nf cell in 32 nm high-k metal-gate CMOS. Constant-negative-level write buffer adjusts bitline level automatically for configuration range of four to 512 cells/bitline, improving write margin at low voltage. Measurement results demonstrate that cell-failure-rate improves by two orders of magnitude at 0.5 V.
A 512 Kb dual-power-supply SRAM is fabricated in 40nm CMOS with 0.179 mum2 cell, which is 10% smaller than the SRAM scaling trend. The smaller cell size is realized by channel area saving. To improve the cell stability of the small channel area cell, we use a WL level-control scheme generated from dual power supplies in the WL driver. An adaptive WL-level programming scheme and dynamic-array-supply...
We proposed a novel SRAM architecture with a high-density cell in low-supply-voltage operation. A self-write-back sense amplifier realizes cell failure rate improvement by more than two orders of magnitude at 0.6 V. A cascaded bit line scheme saves additional process cost for hierarchical bit line layer. A test chip with 256 kb SRAM utilizing 0.495 mum2 cell in 65 nm CMOS technology demonstrated 0...
For the first time, we demonstrate standard cell gate density of 3650 KGate/mm2 and SRAM cell of 0.124 mum2 for 32 nm CMOS platform technology. Both advanced single exposure (SE) lithography and gate-first metal gate/high-k (MG/HK) process contribute to reduce total cost per function by 50% from 45 nm technology node, which is unattainable by dual exposure (DE) lithography or double patterning (DP)...
We showed the new test sequence to solve the at-speed test escapes of SRAM boundary addresses when shared BIST tests the SRAMs of different address sizes in parallel. This test sequence accesses only an address boundary continuously. By using our method, shared BIST can test the SRAMs at-speed in parallel with slight extra area overhead and test time.
In this paper we propose a new metric of SRAM cell stability named static cell-flip voltage (SCFV). In order to measure SCFV, novel design-for-test (DFT) techniques with asymmetric cell-bias-voltage modulation (ACBVM) are introduced, in which the cell-data retention is measured with sweeping potential of a ground node connected to one of the cross-coupled invertors of a cell and source voltage of...
A novel SRAM architecture with a high density cell in low supply voltage operation is proposed. A self-write-back sense amplifier realizes cell failure rate improvement by more than two orders of magnitude at 0.6 V. A cascaded bit line scheme saves additional process cost for hierarchical bit line layer. A test chip with 256 kb SRAM utilizing 0.495 um2 cell in 65 nm CMOS technology demonstrated 0...
A single-power supply 64 kB SRAM is fabricated in a 45 nm bulk CMOS technology. The SRAM operates at 1GHz with a 0.7 V supply using a fine-grained bitline segmentation architecture and with an asymmetrical unit-ratio 6T cell. With the asymmetrical cell, 22% cell area has been saved compared to a conventional symmetrical cell. This bulk SRAM is designed for GHz-class sub-lV operation.
Integration schemes of bulk FinFET SRAM cell with bulk planar FET peripheral circuit are studied for the first time. Two types of SRAM cells with different beta-ratio were fabricated and investigated in the view of static noise margin (SNM). High SNM of 122 mV is obtained in the cell with 15 nm fin width, 90 nm channel height and 20 nm gate length at Vdd = 0.6 V. This is the smallest gate length FinFET...
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