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Demand for increased functionalities and the trend in product miniaturization have created new challenges for electronic packaging. The move to 3-D packages combines the benefits of small footprint packages and through-silicon-vias technology to overcome the limitations. However, thermal management of such packages has become the bottleneck as cooling solutions cannot access the intermediate stacks...
Three dimensional integrated circuits offer significant advantages over single chip packages in terms of functionalities and footprint needed. A key technology to enable the adoption of these advanced packages in electronic systems is Through-Silicon-Via (TSV). The use of TSV has realized integration in the vertical domain. However, as more dies are stacked within the package, the heat generated has...
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