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Contamination and Electrical Overstress are typical failure modes that may appear in failed devices. However, the clean exposure and excellent preservation of such failure sites is often found challenging or even impossible due to the limitations of the decapsulation techniques and tools available. The accuracy of failure analysis can be jeopardized during decapsulation due to the introduction of...
Hermeticity is an important reliability issue for MEMS thin film packages, but difficult to test due to their small volume. We have developed a novel method based on the thin film damping theory to measure the internal pressure and the leak rate of a MEMS thin-film package. The method uses the Focused Ion Beam (FIB) and Laser Doppler Vibrometer (LDV) to monitor the change of the package resonance...
A high performance 22/20nm CMOS bulk FinFET achieves the best in-class N/P Ion values of 1200/1100 μA/μm for Ioff=100nA/μm at 1V. Excellent device electrostatic control is demonstrated for gate length (Lgate) down to 20nm. Dual-Epitaxy and multiple stressors are essential to boost the device performance. Dual workfunction (WF) with an advanced High-K/Metal gate (HK/MG) stack is deployed in an integration-friendly...
An efficient reliability analysis mode, reliability analysis mode based on truncated normal distribution, is proposed for calculating the reliability of mechanical structures. The calculation starts from a dynamic load history, the distribution of loads is determined. In the paper, the stress distribution is supposed as truncated normal distribution and its parameters are determined by finite element(FE)...
This paper describes two major reliability mechanisms: hot-carrier instability (HCI) and negative-bias temperature instability (NBTI). The reliability performance of a typical operational amplifier is shown and analysed. Results show that the circuit performance might improve as transistors degrade. Failure analysis on the mismatch is presented for the first time. Design and optimization issues are...
An experimental investigation into the dynamic strength and strain rate sensitivity of 37 wt% Pb-63 wt% Sn superplastic alloy was carried out. Tests were conducted at room temperature and under both uniaxial compression and tensile conditions. The nominal strain rates were varied by seven orders of magnitude, from 10-4 to 103 s -1. Specimens from two different heat treatments (or phase sizes) were...
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