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This paper presents signal and power integrity analysis of a double-sided flip-chip package. A memory controller is attached on one side of the organic substrate, and 3D-stacked, disaggregated memory chips, integrated with through silicon vias (TSVs), are connected on the opposite side. The signaling path of this 3D memory system consists of a short channel consisting of wafer-level redistribution...
A double-sided Si passive interposer connecting active dies on both sides for a 3D IC integration is investigated. This interposer is 100μm-thick with 10μm-diameter TSVs (through silicon vias), 3 RDLs (redistribution layer) on its front-side, 2 RDLs on its backside. It supports 2 active dies on its frontside and 1 active die at its backside. The present study focuses on the process integration of...
The microelectronic packaging field is moving into the third dimension for miniaturization, low power consumption, and better performance. In this paper, we present a double-sided flip-chip organic substrate with a memory controller on one side of the package, and 3D stacked disaggregated memory chips on the other side of the package. This design allows the controller to interface with the DRAM stack...
This paper presents a double-sided flip-chip package. The package consists of a memory controller on one side of an organic substrate, and 3D-stacked, disaggregated memory chips, integrated with TSVs, on the opposite side. Thermal isolation is one of the key motivations for this configuration. Co-design of all physical layers is required to optimize the integrated 3D package within electrical and...
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