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3D integration technology using through silicon via (TSV) is progressing for high volume manufacturing in various applications. Thin wafer handling using temporary bonding technology is an important process within 3D integration. There are several temporary de-bonding processes being developed and used in industry, such as thermal slide debonding, mechanical de-bonding and laser de-bonding. In general,...
Computational analysis on the dicationic species generated upon two‐electron oxidation of the corresponding allenic compounds bearing two thioxanthene (7a) or two acridene (7b) moieties indicated that the ground‐state multiplicity would be of the triplet state (ΔEST = ECS − ET = 12.6 and 14 kcal/mol, respectively). Under this premise, oxidation reactions of 7a and 7b were carried out. In the case...
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