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Organic carrier is the main factor affecting the morphology of the glass frit sintering, and the shape of the sintering determines the quality of the laser encapsulation. In this work, the volatility of single solvent and mixed solvent have been analyzed, and the sintered temperature curve has been optimized. After the sintering, scanning electron microscopy (SEM) images of the single solvent and...
With the rapid development of modern microelectronics and optoelectronics technology, a novel potential sealing method,Laser-assisted glass frit bonding (hereafter referred to as Laser bonding), are proposed for encapsulating electronic, optical, and miniature micro-mechanical devices that require a hermetic seal with long-term stability. In this work, we fabricated two kinds of glass pastes which...
Localized laser bonding using a glass frit intermediate layer is an ideal technology to hermetically package devices without heating the function components. The glass frit paste is mainly composed of functional fillers, low temperature vanadate glass powder and organic carrier. The viscosity of glass frit has an important influence on screen printing, pre-sintering and laser bonding quality. The...
Localized laser bonding using a glass frit intermediate layer is an ideal technology to hermetically package miniature devices without heating the function components. It is important to describe the laser energy transmission and absorption in glass frit when modeling heat transfer in transmission laser bonding of glass to glass. Excess energy leads to over-burning of the glass material and deficit...
Localized laser bonding using a glass frit intermediate layer is an ideal technology to hermetically package miniature devices without heating the function components. It is important to describe the laser energy transmission and absorption in glass frit when modeling heat transfer in transmission laser bonding of glass to glass. Excess energy leads to over-burning of the glass material and deficit...
With the continuous improvement of the electron component integrating, the packet size and weight of micro electro-devices are continue shrinking. The convenient and low-temperature processing techniques are the trend of bonding techniques. Glass frit bonding technology has advantages which include a relatively low joining temperature, and less stringent requirements for contact surface smoothness...
Recently the active-matrix organic light-emitting diode (AMOLED) has emerged as a very promising flat-panel display technology because of its potential widely application for the development of high resolution and flexible full color flat panel displays. However, the encapsulation of AMOLED is studied and developed due to the top-emission structure used in AMOLED. Different from the bottom-emission...
A semi-automatic laser bonding system is developed to provide a localized heating manner for semiconductor device and MEMS encapsulation, especially for devices which have thermal-sensitive materials inside. This system consists of five modules, including laser module, motion module, fixture module, monitoring module and control module. Several bonding tests are carried out using this system with...
Organic light-emitting device (OLED) is regarded as the potential application for future display. However, one of the bottlenecks is the OLED package issue, which results in short term device lifetime. Currently, a new laser bonding package process is proposed. In this paper, the investigation of transient temperature field analysis for the laser bonding process is presented. Finite element model...
For micromilling to be used in the manufacturing of glass-based devices, further machining research is required to find optimum cutting configurations to produce high quality micro-scale features. It is not only extremely expensive but also difficult to investigate machining mechanism by means of various experiments. In this paper, the effect of cutting condition on cutting mechanics is numerically...
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