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For modern microelectronics solders lifetime and stability predictions are important. To perform such an analysis material properties are required. As electronic devices and the corresponding amount of matter used become smaller, the influence of a changing microstructure on mechanical properties must be considered. First some analytical methods were conducted for upper and lower bounds ignoring the...
In der Mikroelektronik spielen die Gruppe der Lotwerkstoffe eine wichtige Rolle. Sie stellen zwischen einzelnen Komponenten, wie beispielsweise Chip und Platine, nicht nur die elektronische, sondern auch die mechanische Verbindung her. Ihre Stabilität ist deshalb zur Lebensdauervorhersage mikroelektronischer Bauteile von besonderer Bedeutung. Die unterschiedlichen verwendeten Legierungen weisen dabei...
Several types of microstructural changes in microelectronic solder materials are briefly discussed, namely the formation of intermetallics, Kirkendall voiding, spinodal decomposition, and coarsening. Moreover, a theoretical framework, based on the entropy principle, is developed by means of which constitutive equations can be derived that are necessary to understand and simulate such processes. The...
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