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The GOX is the most fragile element of a MOS transistor. With the scaling of device, the GOX thickness has been reduced to a few atomic layers, therefore any tiny defects in gate oxide can lead to high leakage current and even gate oxide breakdown. FIB/TEM analysis and chemical wet etching pinhole technology are usually adopted to characterize GOX leakage defect. However, TEM by FIB-cross section...
Wafer level package (WLP) sample is one of the most popular packaged methods due to its low cost (wafer batch process), high performance, small form factor and low assembly cost [1]. Decapsulation is necessary for failure analysis. Fig. 1 and Fig. 2 are the sketch maps of the WLP wafer with Sn balls on the chip. The stannum (Sn) ball on the package need be removed while the copper line (Re-distribution...
Process sensitivity of IMD TDDB in a vertical natural capacitor (VNCAP) structure was evaluated in this paper. Among others, CMP slurry and wet clean chemical were found to have higher level of interaction impacting TDDB performance. This enables proper process optimizations, such as reduction in the Cu+ concentration on ULK top surface. Additionally, dependence of the structure was analyzed and the...
Business Process Management (BPM) is to optimize processes to gain competitive advantage. It is very important for an enterprise to keep in good status. However, many business process improvements are not very successful. This paper proposes a model using value engineering and TRIZ for better performance. Value engineering is an approved systematic method focusing on quantitative function analysis...
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