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The electronics industry has successfully transitioned to lead free soldering for computer and consumer products while in the automotive industry due to the very high reliability requirements this step is still in an ongoing process. In order to ensure or even to enhance the reliability of electronics the improvement of lead free solder joints based on Sn-Ag-Cu (SAC) solder has been the focus of many...
The interfacial reaction between Sn/Au bumps and a thin Au/TiW metallization was investigated. It was found that for 60μm bumps, the pad metallization was not reliable and large voids were generated after multiple reflow cycles due to the dewetting between eutectic AuSn and TiW. For 40 and 20μm bumps, the Au/TiW was quite stable and the joints could be entirely composed of TiW/Au 5 Sn/Au because...
Chronically implantable, wireless neural interfaces require biocompatible, long term stable, and high density integration of all functional sub-components. For this, the integration and interconnection concept of the wireless neural interface was proposed and interconnection materials and methods were investigated and characterized. The module consists of an electronics IC assembled to an electrode...
In order to reduce costs in packaging especially for optoelectronic devices technologies are desirable that enable precise assembly at low cost. A flip chip assembly approach is presented using the self-alignment mechanism in combination with mechanical stops. Besides eutectic AuSn20 solder (80 wt.-% Au, Tm = 280 degC) which is widely used in optoelectronics the eutectic SnAg3.5 solder (96.5wt.-%...
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