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The reliability of automotive electronics depends a great deal on solder joints. After the WEEE and RoHS came into effect the new focus became lead-free solder pastes such as SnAg or SnAgCu (SAC). One approach to improve the thermal fatigue properties of these alloys is to add a third or fourth alloying element SAC + X. Until now, this was always done by metallurgical alloying, requiring special apparatuses,...
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