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Nanoscale resistance reset of the SiO2/M stack (where M=Cu, Ni, Ti, Al, p-type Si) was investigated via a conductive atomic force microscope (C-AFM). Visible-light illumination triggers a resistance reset for Ti, Al and p-type Si electrodes, however such a behavior is not always observed for the Cu and Ni electrodes. Conversely, electrical reset is possible for Cu and Ni, but not for the others. The...
ABC transporters, which comprise one of the largest protein families, are involved in maintaining osmotic homeostasis, nutrient uptake, pathogen resistance, and metal tolerance. In this study, 30 ABC genes in dwarf polish wheat were characterized and classified into seven subfamilies (ABCA - ABCG). Among them, 24 ABC transporters were newly found in wheat. The expressions of 13 ABC genes in roots...
The interfacial reaction in Cu/Sn-9Zn/Cu and Cu/Sn-9Zn/Ni interconnects during electromigration (EM) were investigated under a current density of 5.0 × 103 A/cm2 at 150 °C. An obvious reverse polarity effect in Cu/Sn-9Zn/Cu and Cu/Sn-9Zn/Ni interconnects during EM was demonstrated, i.e., the interfacial IMCs at the cathode grew continuously and were remarkably thicker than those at the anode. The...
Different diffusion behavior of Cu, Ni and Zn atoms in Cu/Sn-9Zn/Ni interconnects during liquid-solid electromigration (L-S EM) were investigated under a current density of 5.0 × 103 A/cm2 at 230 oC. When Cu atoms were under downwind diffusion, L-S EM enhanced the cross-solder diffusion of Cu atoms to the opposite Ni side compared with the liquid-solid reaction case, resulting in the formation of...
Different diffusion behavior of Cu, Ni and Zn atoms in Cu/Sn-9Zn/Ni interconnects during liquid-solid electromigration (L-S EM) were investigated under a current density of 5.0 × 103 A/cm2 at 230 oC. When Cu atoms were under downwind diffusion, L-S EM enhanced the cross-solder diffusion of Cu atoms to the opposite Ni side compared with the liquid-solid reaction case, resulting in the formation of...
The laser cladding technique was used to produce Ni alloy coatings with different SiC particle (SiC p ) contents on steel 1045. The complete dissolution of SiC p took place during laser melting and led to a microstructural evolution of the coatings associated with the SiC p content. M 7 X 3 or M 23 X 6 -type carboborides and Ni-base solid...
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