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A silicon/disordered-carbon powder was applied as the negative electrode material in Li ion batteries. The thermal characteristics of the Si/C electrode mixed with or without the electrolyte were investigated by DSC. Both lithiated (with capacity of 1120mAhg −1 ) and delithiated Si/C electrode powder showed exothermic peaks in DSC curves due to the reactions between the Li in the electrode...
As the speed of digital systems continues to increase, digital design has entered a new realm that requires high integration and high complexity with limited dimension. Different from the parameter analysis in low frequency which mainly focuses on resistances and their effects, the coactions of resistances, inductances and capacitances are all needed to be taken into account in high frequency. This...
This paper reports the designing/simulation and experimental investigation into the Deep RIE-based micro-fabrication of through-Si-via (TSV) which acts as the vital vertical interconnect for compact 3-D system-in-package integration. An in-house developed process simulator based on cell/string evolution algorithm and physical modeling is used to explore suitable DRIE conditions for drilling vias with...
A TSV (Through Silicon Via) structure with I-shaped structure for 3D packaging is proposed in this paper. Based on the notching effect and gradient etching process of DRIB, this kind of structure can be fabricated in the existed facilities, without additional processes and equipments. According to microwave transmission line theory and by using finite element full-wave analysis tool, simulation of...
TSV (through silicon via ) has been widely welcomed as an enabling technology for three-dimensional integration in a package with high density. The developing of a drilling method for TSVs with tapered sections by experimental methodology can be a tedious task. The authors thus explore the possibility to simulate the process conditions effectively with an in-house developed simulator which utilize...
This paper reports a bulk micromachined microwave tunable lowpass filter with its resonator tuned by butterfly-like loading bridges on Pyrex glass. Effectively, the filter is tuned by shifting the first transmission zero, and is based on 7th order ellipse architecture, whose use in RF MEMS filters has not been reported as far as the authors know. Perturbation method is used to anticipate analytically...
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