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Sn-Ag-Cu base solders are the most potential candidates to substitute of Sn-Pb eutectic solder. Gold (Au) coatings are used to protect conductor surface from oxidation and thereby to promote the solderability, and nickel (Ni) is often used as a diffusion barrier layer between lead-free solders and substrates to restrict the growing of intermetallic compound layers. And the gold and nickel also are...
The microstructure modification of the solder joint formed between the OSP Cu substrate and Sn3.5Ag lead-free solder was explored in this paper. The 0.2Co0.1Ni additives were added into Sn3.5Ag solder matrix. And the refined bulk microstructure, namely, the depressed Sn-halo growth, was found, which could be interpreted by the eutectic growth theory and interaction behavior between the component elements...
The additives Ni and Co were selected to modify the micro structure of Sn3.5Ag lead-free solder. The soldering was performed between the solders and Cu substrate at 250degC. The additives were detected to participate in the interface reaction. And the non-homogeneous micro structure was identified due to the discontinuity of the additive concentration at the entire IMC region. The outer area of IMC...
Small amount of additives, namely, 0.2Co + 0.1Ni, were doped into the Sn3.5Ag solder matrix which has been considered as one of the most promising candidates to replace the conventional Sn-Pb solders. The mechanical properties of the lead-free solders were assessed from the force-penetration curves measured by nanoindentation testing. These mechanical properties were then used as the input parameters...
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