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Sn-Ag-Cu base solders are the most potential candidates to substitute of Sn-Pb eutectic solder. Gold (Au) coatings are used to protect conductor surface from oxidation and thereby to promote the solderability, and nickel (Ni) is often used as a diffusion barrier layer between lead-free solders and substrates to restrict the growing of intermetallic compound layers. And the gold and nickel also are...
Small amount of additives, namely, 0.2Co + 0.1Ni, were doped into the Sn3.5Ag solder matrix which has been considered as one of the most promising candidates to replace the conventional Sn-Pb solders. The mechanical properties of the lead-free solders were assessed from the force-penetration curves measured by nanoindentation testing. These mechanical properties were then used as the input parameters...
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