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Chemical mechanical polishing (CMP) performance influence the reliability of TSV process, because the wafer chip-to-chip vertical interconnections for the next process request the TSV wafer a flat surface without defects after CMP. The influence of ECD process to the CMP defects, further to the via-filling effect, was investigated. Thickness uniformity, top surface morphology and the grain orientation...
It has been widely accepted that for brain MR images, both the image density inhomogeneity (slowly-varying intensity changes across the field of view) and partial-volume effect (PVE) (more than one tissue type present in a single voxel) considerably reduce the accuracy and reliability of quantitative analysis for various clinical purposes. This paper presents a unified expectation-maximization (EM)...
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