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A signal shift following solder reflow or temperature cycle stress testing can severely affect micro-electro-mechanical systems (MEMS) product performance in encapsulated package. This is mainly attributed to nonlinear material property of the mold compound, a key low cost packaging material. Due to viscoelastic characteristic, the mold compound exhibits a temperature and time dependent behavior....
The stresses due to moisture saturation on microelectromechanical systems (MEMS) sensor devices after exposure to temperature cycling have been addressed. Moisture-, temperature-, and time-dependent material property of molding compounds for the MEMS devices were characterized. To determine the coefficient of hygroscopic swelling of a molding compound and diffusivity ($D)$ of water in the molding...
Packaging materials influence greatly on reliability and performance of electronics components. While, materials such as molding compound protect the package from the environment; different mechanical properties of materials will inevitably introduce stress to the package. In this study, materials' viscoelastic effect on packaging stress in a MEMS sensor was studied using finite element analysis after...
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