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In this paper, we present the design and fabrication of piezoresistive Microwave Impedance Microscopy (MIM) cantilever probes integrated with low impedance, electrically-shielded sharp tips to enable simultaneous topographical and electrical scanning probe microscopy. The fabricated probes show a piezoresistive resolution of 2 nm in 1 Hz to 10 kHz bandwidth, which ensures high quality topographic...
Metal MEMS structures can be formed by metal electroplating with the aid of thick-photoresist molds. The microfabrication features low-temperature process that is post-CMOS compatible and can be used for on-chip integration of high-performance RF parrives for RFICs. On the other hand, The plating process can be combined with silicon micromachining techniques to build operation tools, like probe-cards,...
Presented is a MEMS probe-card with ultra dense two dimensional (2-D) probe arrays for wafer-level IC test. About 110000 probe tips can be simultaneously fabricated in a 4-inch wafer, with the 2-D tip pitch as 240 mum times 160 mum. The "hoe-shaped" microprobe structure is composed of one or two planar arms and an up-tilted tip, both of which are high-yield fabricated by metal micromachining...
Presented is a new micromachining technology for high-yield fabrication of silicon AFM probes. Both tips and cantilevers are simultaneously formed with a masked-maskless-combined anisotropic etching process. The cantilever contour is firstly formed by masked etching. Then, the SiO2 etching mask is removed while the mask for tip-contour formation is remained. Following the combined etching is performed...
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