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Signal integrity (SI) simulation for system-in-package (SiP) is a bottleneck in SiP design flow. This paper presents a novel numerical algrothm for SI simulation in packaging structure. This algorithm is based on 2D Generalized Transmission Line Equation (GTLE), Finite Difference Time Domain (FDTD) and mesh division technique. SI is simulated using mesh division technique where the model of SI is...
In high-speed applications, electronic packages usually contain multilayer power-ground planes with large number of P-G vias to provide a low-impedance path for the power distribution system between the PCB and the die. The transient current injected into the P-G planes can induce unintentional voltage fluctuations in the power distribution network of the packages. The undesired voltage fluctuations...
The inventory model for deteriorating items with general trapezoidal type demand rate and partial backlogging rate is investigated in this paper. The deteriorating rate is a generous positive time-varying Weibull function, and the demand rate is a general trapezoidal type function. In this model, we allow the product out of stock. Assume that production function is a linear function of inventory level...
Application-level checkpointing can decrease the overhead of fault tolerance by minimizing the amount of checkpoint data. However this technique requires the programmer to manually choose the critical data that should be saved. In this paper, we firstly propose a live-variable analysis method for MPI programs. Then, we provide an optimization method of data saving for application-level checkpointing...
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