The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
The ball impact test (BIT) was developed based on the demand of a package-level measure of the board-level reliability of solder joints in the sense that it leads to brittle intermetallic fracturing, similar to that from a board-level drop test. The BIT itself stands alone as a unique and novel test methodology in characterizing strengths of solder joints under a high-speed shearing load. In this...
We investigated the reliability of a board-level wafer-level chip-scale package (WLCSP) subjected to different accelerated current stressing conditions at a fixed ambient temperature of 125 degC. A reasonably good correlation between mean-time-to-failure of the WLCSP test vehicle and the average current density carried by a solder joint was obtained. Moreover, the trace breakage was identified as...
This paper is concerned with constructing a high-G drop impact test condition for investigating the impact induced failure phenomenon of the solder ball array located in the chip packaged printed circuit board. An impact environment satisfying the JEDEC B service conditions was constructed using an instrumented drop tower tester. Fifteen wafer-level CSP chips were installed on a standard printed circuit...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.