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Although the emerging 3D DRAM products can significantly improve the computing system performance, the relatively high cost is one of the most critical issues that prevent their wide real-life adoption. Intuitively, a strong memory fault tolerance can be leveraged to reduce the fabrication cost of DRAM dies, and the total cost will reduce if the fabrication cost saving can off-set the cost overhead...
This paper presents a comprehensive investigation on retention behavior for three-dimensional charge trapping NAND flash memory by two-dimensional self-consistent simulation. Major physical mechanisms, including tunneling, charge trapping and de-trapping process as well as drift-diffusion have been incorporated into the simulator. The developed simulator is able to describe the charge transport along...
Sn2.5Ag0.7Cu0.1RE/Cu solder joints were obtained with ultrasonic vibration assisted. Microstructure and properties of the joints were studied. Experimental results show that reliable soldering of Sn2.5Ag0.7Cu0.1RE/Cu can be achieved under condition of ultrasonic power of 88 W and low-halogen flux. The maximum shear strength of 26.0 MPa is obtained from the joint soldered at ultrasonic vibration time...
This paper presents a two dimensional numerical simulation on the program and retention operation of charge trapping memory. The developed simulator self-consistently solves two-dimensional Poisson equation, carrier continuity equation and trapped charge conservation equation. Driftdiffusion transport scheme is used for modeling the charge transport in the trapping layer. Major physical models, such...
Sn2.5Ag0.7Cu0.1RE/Cu solder joints were obtained with ultrasonic vibration assisted. Microstructure and properties of the joints were studied. Experimental results show that reliable soldering of Sn2.5Ag0.7Cu0.1RE/Cu can be achieved under condition of ultrasonic power of 88 W and low-halogen flux. The maximum shear strength of 26.0 MPa is obtained from the joint soldered at ultrasonic vibration time...
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