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In article number 1904276, Jeremy S. Luterbacher and co‐workers present an easily scalable method for atomic layer deposition on high‐surface‐area materials and nanoparticles. Oxides, sulfides, and phosphates are deposited in the liquid phase without using any excess reactant, while the gas‐phase coating quality is preserved.
Atomic layer deposition (ALD) is a well‐established vapor‐phase technique for depositing thin films with high conformality and atomically precise control over thickness. Its industrial development has been largely confined to wafers and low‐surface‐area materials because deposition on high‐surface‐area materials and powders remains extremely challenging. Challenges with such materials include long...
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