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We propose an novel ultra-dense, low-loss optical coupling solution with optimized coupler design for silicon photonics chip, which is a key enabling technology for optical chip scale package with 336 channels.
Optical chip scale package is a key transceiver technology for future communication networks. A novel scheme is proposed with 336 electrical and optical channels integrated on single substrate. A novel ultra-dense optical IO solution for silicon photonics chips is proposed as an important enabling technology.
An ultra-dense optical IO solution for silicon photonic chip is proposed, based on multi-core fiber array and three dimensional optical interposer. We demonstrate an 84-channel prototype with 3.5mm width on optical coupling interface.
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